Molex VHDM® H系列背板连接器系统
Molex设计了VHDM® （非常高密度公制）H系列背板连接器系统，用于具有非常高的互连密度和高速信号完整性要求的应用。VHDM® H系列背板连接器系统在安装基础上可实现高达6.25Gbps的数据率，并可在无需重新设计昂贵架构的情况下进行系统升级。VHDM® H系列拥有一个插配接口和与之前系列一样的外壳，与现有的VHDM插槽完全向后兼容。使用Molex VHDM® H系列背板连接器系统，设计人员可延长现有平台的寿命，将开发成本降至最低，并加快较高性能应用进入市场的速度。
特性
- Data rates up to 6.25Gbps
- Mates with existing VHDM® systems to enable backwards compatibility with existing VHDM® slots
- Ability to combine VHDM L-Series (1Gbps), VHDM (3.125Gbps), VHDM H-Series (6.25Gbps) and VHDM-HSD (5Gbps) wafers on the same metal stiffener
- Internal ground shields control impedance and minimize cross talk
- Small compliant-pin 0.45mm (.018”) PCB hole size
- Modular construction maximizes design flexibility via custom configuration of signal, power and guide modules
规范
- 1A signal contact
- Shield Contact:
- 6 Row - 2A
- 8 Row - 3A
- 10A per power blade
- Delivers up to 120.0A per 25mm (.984") of board edge
- Multiple mating levels for hot plug applications
应用
- Telecommunication equipment
- Hubs, switches, routers
- Central office, cellular infrastructure and multi-platform (DSL, Cable Data) systems
- Medical imaging
- Data networking equipment
- Storage
- Servers
- Test and measurement equipment
- Military
Additional Resources
Related Solutions
Molex 数据/计算解决方案
各种适用于高端服务器、工作站以及先进存储设备的解决方案。
发布日期: 2011-02-17
| 更新日期: 2022-03-11