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Chip Quik Sn95.5/Ag4.0/Cu0.5 Solder Spheres for BGAs

Chip Quik Sn95.5/Ag4.0/Cu0.5 Solder Spheres for BGAs are manufactured from virgin materials to meet or exceed the requirements of building or repairing BGA packages. These solder spheres also exceed MIL standards and IPC for size tolerances and purity levels. The Sn95.5/Ag4.0/Cu0.5 solder spheres are available in nominal sizes from 0.20mm to 0.76mm (8mil to 30mil). These solder spheres are Lead-free and REACH-compliant. The Sn95.5/Ag4.0/Cu0.5 solder spheres are compliant with RoHS 3, REACH, and conflict minerals. These solder spheres operate at 217°C (423°F) melting point and are available in up to 0.60mm sphere diameter.

Features

  • REACH compliant
  • RoHS 3 compliant
  • Conflict minerals compliant
  • Lead-free
  • >24 months shelf life

Specifications

  • Sn95.5/Ag4.0/Cu0.5 alloy
  • 1.1mm/0.60mm/0.50mm/0.30mm sphere diameters
  • 217°C (423°F) melting point

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Chip Quik SMD2088-6000 BGA Solder Spheres

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Learn More关于Chip Quik SMD2088-6000 BGA Solder Spheres View Products与Chip Quik SMD2088-6000 BGA Solder Spheres相关
View Results ( 4 ) Page
物料编号 制造商名称 描述 数据表
CQ-SS-SAC405-0.50MM-25000 Chip Quik 焊料 焊料 Spheres Sn95.5/Ag4.0/Cu0.5 0.50mm diameter 25K Bottle CQ-SS-SAC405-0.50MM-25000 数据表
CQ-SS-SAC405-0.30MM-25000 Chip Quik 焊料 焊料 Spheres Sn95.5/Ag4.0/Cu0.5 0.30mm diameter 25K Bottle CQ-SS-SAC405-0.30MM-25000 数据表
CQ-SS-SAC405-0.60MM-25000 Chip Quik 焊料 焊料 Spheres Sn95.5/Ag4.0/Cu0.5 0.60mm diameter 25K Bottle CQ-SS-SAC405-0.60MM-25000 数据表
SMD2088-6000 Chip Quik 焊料 焊料 Spheres Sn96.5/Ag3.0/Cu0.5 .044" (1.1mm) diameter 6K Bottle (SAC305 lead-free solder balls) SMD2088-6000 数据表
发布日期: 2023-08-31 | 更新日期: 2026-01-20