onsemi / Fairchild 仙童半导体 Motion SPM® 模块

仙童半导体 Motion SPM® 模块将驱动和保护电路集成在单片封装中。使用该 Motion SPM 模块来简化并加速设计,同时达到最高效率。有时,这些器件也被称作智能功率模块(IPM)。

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onsemi / Fairchild 仙童半导体 Motion SPM® 模块

特性

  • Wide breadth of packaging for motor control applications (below 10 HP)
  • Optimized packaging for thermal performance, high-power density, and robust assembly
  • Exceed low cost and high-efficiency requirements for home appliance applications
  • Wide range of guaranteed junction temperature of -40°C to +150°C
  • Packages with more creepage/clearance for high voltage applications
  • Better ruggedness, optimized conduction losses, and switching losses
  • High production reliability optimizes customer manufacturing yield
  • Compactness for low/mid-power industrial applications

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SPM Modules Portfolio

onsemi / Fairchild 仙童半导体 Motion SPM® 模块
发布日期: 2015-05-08 | 更新日期: 2023-01-05