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Littelfuse Raychem ChipSESD保护器

TE Connectivity在其 硅ESD（静电放电）保护系列中增加了Raychem ChipSESD。ChipSESD装置是业界最小的0201和0402芯片级封装(CSP)器件，并具有双向技术和超低电容。 比传统封装的半导体ESD装置易于安装和重新加工，0201和0402尺寸的ChipSESD融合了活性硅和传统的SMT无源封装配置的优点。TE Connectivity Raychem ChipSESD保护器有助于保护小型便携式装置中的敏感IC，如手机、LCD和等离子显示器、HDMI、USB、DisplayPort、其他高速数字或低压天线接口。

特性

  • Small EIA 0201 and SOD882 case sizes
  • Standard PCB assembly and rework processes
  • Bidirectional operation allows placement on PCB without orientation constraint
  • Appropriate for ESD protection in space-constrained portable electronics and mobile handsets
  • Suitable for +5V operating voltage applications
  • Helps protect electronic circuits against damage from Electrostatic Discharge (ESD) events
  • Assist equipment to pass IEC61000-4-2, level 4 testing
  • RoHS compliant and halogen free

应用

  • Small portable electronics
  • Mobile phones
  • LCD and plasma displays
  • HDMIs
  • USBs
  • DisplayPorts
  • Other high-speed digital or low-voltage antenna interfaces
发布日期: 2011-03-14 | 更新日期: 2022-03-11