Parker Chomerics THERM-A-GAP™ Thermally Conductive Pads
Parker Chomerics THERM-A-GAP™ Thermally Conductive Pads are designed for applications where heat must be conducted over large and variable gaps between a semiconductor component and a heat-dissipating surface. This family of low soft, thermally conductive silicone and non-silicone elastomers provides excellent thermal properties and high conformability at low clamping forces. These thermally conductive gap-filler sheets and pads from Parker Chomerics reduce stress on components and can blanket multiple components for superior coverage. The thicker pads also help improve vibration dampening in applications. The product line is ideal for a wide range of applications, including telecommunications and 5G equipment, lighting, computers, handheld devices, and automotive electronic control units (ECUs).
Features
- High conformability
- Ultra-low deflection force
- Thicker pads can improve vibration dampening
- Minimal component stress
- High tack surface to reduce contact resistance
- Reduced hotspots on printed circuit boards
- Can blanket multiple components
Applications
- Telecommunications equipment
- 5G equipment
- Smart home devices
- Consumer electronics
- Automotive ECUs
- LEDs and lighting
- Power conversion
- Power semiconductors
- Desktop computers, laptops, and servers
- Handheld devices
- Memory and data storage units
- GPUs and CPUs
- Industrial devices
- Vibration dampening (thicker variants)
Application Examples
Featured Products
Parker Chomerics THERM-A-GAP™ 579 3.0W/m-K Low Hardness Gap Pads
30 Shore 00 hardness and 3W/m-Ka thermal conductivity, offers a flexible solution for applications.
Parker Chomerics THERM-A-GAP™ G974 5.0W/m-K Low Hardness Gap Pads
Low hardness of 40 Shore A and thermal conductivity of 5.0W/m-K, provides a flexible solution.
Parker Chomerics THERM-A-GAP™ HCS10 1.0W/m-K Low Hardness Gap Pads
Low hardness of 4 Shore 00 and a thermal conductivity of 1.0W/m-K, offers a cost-effective solution.
Parker Chomerics THERM-A-GAP™ PAD 30 3.2W/m-K Low Force Gap Pads
Solution for applications that require a moderate thermal performance in electronic device designs.
Parker Chomerics THERM-A-GAP™ PAD 60 6.0W/m-K Low Force Gap Pads
6.0W/m-K thermal conductivity, excellent heat transfer, low compression forces, and conformability.
Parker Chomerics THERM-A-GAP® PAD 80 8.3W/m-K Gap Pads
Thermally conductive, high-performance gap-filler pads with 8.3W/m-K typical thermal conductivity.
Parker Chomerics THERM-A-GAP® PAD 70TP 7W/m-K Thermal Putty Sheets
Typical thermal conductivity of 7.0W/m-K for superior thermal performance and long-term stability.