新款导热接口产品

Bourns BTJ热跳线芯片是独特的表面贴装元件,具备高导热性,同时保持绝缘特性。 此系列跳线芯片专为导热散热而设计,适用于各类移动设备和电子设备。BTJ跳线芯片具有高绝缘电阻和低电容,工作温度范围为-55°C至155°C。该系列跳线芯片可简化复杂的热设计,降低关键器件的温升,从而提升系统级可靠性。典型应用包括电源、开关电源、转换器、放大器/射频、GaN、各类ECU、PIN二极管与激光二极管以及数据服务器。
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Bourns BTJ热跳线芯片独特的表面贴装元件,具备高导热性,以支持散热。2026/2/2 -
Advanced Thermal Solutions Thermal Transfer Plates for NVIDIA® Jetson™Designed for targeted heat management for NVIDIA® Jetson™ modules lacking integrated thermal plates.2025/11/6 -
Laird Technologies Tflex™ HR6.5 Thermal Gap FillerThermal interface material with >6W/mK thermal conductivity with high recovery properties.2025/9/15 -
Laird Technologies Tflex™ CR350S 2-Part Dispensable Gap FillersProvide high thermal conductivity, low thermal resistance, and high reliability.2025/9/9 -
Laird Technologies Tputty™ SF560 1-Part Dispensable Gap FillersDesigned to offer thermal conductivity of 5.6W/mK, along with superior thermal resistance.2025/8/25 -
Laird Technologies Tflex™ CR550 2-Part Dispensable Gap FillerTransfers unwanted heat in automotive components and the A+B putty material cures in place.2024/10/25 -
Laird Technologies Tflex SF4 Thermal Gap FillersSilicon-free and offers a 0.5mm to 4mm thickness range with 4.0W/mK thermal conductivity.2024/9/10 -
Laird Technologies Tflex SF7 Thermal Gap FillersInnovative, high-performing thermal material with silicone-free construction.2024/9/10 -
Bergquist Company TGF 2900LVO 2.9W/m-K Limited Outgassing Gap FillerSilicone, two-part room-temperature curable gap filler ideal for electronic assembly applications.2024/5/30 -
Bergquist Company TGP 40000SF 40W/m-K Silicone Free GAP PAD®Features gap-filling materials that achieve an ultra-high 40W/m-K thermal conductivity.2024/5/27 -
Stackpole Electronics TMJ Surface Mount Thermal Jumper Chip ResistorsFeatures chip sizes ranging from 0603 to 2512.2024/1/18 -
MG Chemicals Non-Silicone Liquid Thermal Gel1-part gel that offers extreme thermal conductivity and flame retardancy.2023/10/30 -
LeaderTech TCF超薄碳纤维散热焊盘低热阻、表面柔软,主要使用碳纤维作为导热填料。2023/10/18 -
LeaderTech TTN超薄散热焊盘具有低热阻,通过结合石墨和硅胶制造而成。2023/10/18 -
LeaderTech TCI复合铟片熔点处从固体向液体过渡,在室温下再次向固体过渡。在熔点时由固态转变为液态,在室温下再次转变为固态。2023/10/18 -
Wakefield Thermal 127-12 Extreme Performance Sil-Free Thermal GreaseFeature extreme performance, phase change, and non-silicone with 12W/m-K thermal conductivity.2023/9/27 -
Wakefield Thermal 127-6 High-Performance, Sil-Free Thermal GreaseHigh-performance, non-silicone thermal grease syringe with 6W/m-K thermal conductivity.2023/9/13 -
Laird Technologies CoolZorb 200 Hybrid TIM/EMI AbsorbersHybrid absorber/thermal management materials used for EMI mitigation and heat dissipation.2023/9/8 -
Bergquist Company 数据中心应用先进的材料有助于热管理、长期可靠性和应力保护。2023/4/1 -
Laird Technologies Tpcm™ 7000 High-Performance TIMsDesigned to enhance the cooling of the thermal challenges in electronics.2022/8/3 -
Laird Technologies Tflex™ HD7.5 Thermal Gap FillerSoft silicone material that offers high deflection and 7.5W/mK thermal conductivity.2022/8/3 -
Laird Technologies Tpcm™ 5000 High-Performance TIMFeatures low thermal resistance and a non-silicone formulation with a naturally tacky surface.2022/7/19 -
Bergquist Company Liqui-Form TLF 10000 10W/m-K Thermal GelAssures high thermal conductivity, good dispensing efficiency, and high thermal reliability.2022/7/11 -
Laird Technologies Ttape™ 1000A Thermally Conductive TapePressure-sensitive adhesive with low thermal resistance, only needs finger pressure for application.2022/6/3 -
Bergquist Company EV Charging SolutionsDesigned to provide safe charging while protecting EV battery packs from thermal/electrical events.2022/4/13 -
