Wakefield Thermal PL ulTIMiFlux™ Thermal Gap Fillers
Wakefield Thermal ulTIMiFlux™ Thermally Conductive Gap Filler comprises an ultra-soft thermally conductive silicone supplied as a two-component liquid dispensable material. The thixotropic gap filler from Wakefield Thermal is designed to remain where it is dispensed, conform to the surface, and cure in place. This provides thermal protection at thin bond lines with little to no stress on the components during assembly.
Features
- Dispensible 2-part silicone
- High-temperature resistance
- Low stress on components, shock absorbing
- Low volatile organic chemicals (VOCs)
- Halogen free and RoHS compliant
Specifications
- 1:1 mix ratio by weight
- >400V/mil dielectric breakdown strength
- Cure conditions
- 15 hours at +25°C
- 30 minutes at +100°C
- UL 94V-0 flammability rating
- -60°C to +200°C temperature range
- Gray color (after mixing)
- 64000cP viscosity
- 1.0W/mK thermal conductivity
- Hardness of 5
Related Gap Pads
Wakefield Thermal PL ulTIMiFlux High Performance Thermal Pad
A variety of sizes, thicknesses, conductivities, and durometers for a custom thermal solution.
Related Phase Change Materials
Wakefield Thermal ulTIMiFlux™ Dielectric Phase Change TIM
Thermally conductive electrical insulators for semiconductor-to-heat sink interfaces
Related Thermal Tapes
Wakefield Thermal DST Double-Sided Adhesive Thermal Tapes
Widely used to bond heat sinks to microprocessors and other power-consuming semiconductors.
Related Thermal Greases
Wakefield Thermal 127-12 Extreme Performance Sil-Free Thermal Grease
Feature extreme performance, phase change, and non-silicone with 12W/m-K thermal conductivity.
Related Thermal Interface Materials
Wakefield Thermal BT BondaTherm™ Thermal Equalizer Kits
Eliminates improper ratios and mixing errors commonly found with other epoxy combinations
Related ulTIMiFlux™ Products
Wakefield Thermal ulTIMiFlux™ Thermal Interface Material
Excellent replacement for thermal greases designed to improve thermal transfer to the heat sink
Wakefield Thermal PLK ulTIMiFlux™ Gap Pad Evaluation Kits
Features excellent flame retardance and includes 9 varieties of thermal interface materials (TIMs).
Wakefield Thermal ulTIMiFlux™ Dielectric Phase Change TIM
Thermally conductive electrical insulators for semiconductor-to-heat sink interfaces
Wakefield Thermal PL ulTIMiFlux High Performance Thermal Pad
A variety of sizes, thicknesses, conductivities, and durometers for a custom thermal solution.
Related Heat Sinks
Wakefield Thermal DC/DC Power Brick Heat Sinks
Available in various fin heights and orientations.
Wakefield Thermal Heat Sink Extrusions & Profiles
Available in 1- and 3-foot lengths, manufactured by pushing hot aluminum billets through steel die.
Wakefield Thermal SKV High Power Skived Fin Heat Sinks
Alternatives to extruded heat sinks and manufactured using copper or aluminum with 0.5mm thick fins.
Wakefield Thermal 960 Series Push-Pin Heat Sinks
Feature pre-assembled plastic push pins with a flexible barb that engage precisely with PCB holes.
Related Push Pins
Wakefield Thermal 960 Series Push Pins for Heat Sinks
Designed to work with the 960 series heat sinks and offers an overheight range of 17.6mm to 22.1mm.
Related Products
Wakefield Thermal BT BondaTherm™ Thermal Equalizer Kits
Eliminates improper ratios and mixing errors commonly found with other epoxy combinations
Wakefield Thermal ulTIMiFlux™ Dielectric Phase Change TIM
Thermally conductive electrical insulators for semiconductor-to-heat sink interfaces