ROHM Semiconductor SCT3x第三代SiC沟槽MOSFET
ROHM SCT3x第三代SiC沟槽MOSFET采用专属的沟槽式栅极结构,与平面型SiC MOSFET相比,其导通电阻降低了50%,输入电容降低了35%。这就大大降低了开关损耗并加快了开关速度,提高了效率,同时降低了各种设备的功率损耗。这些MOSFET提供650V和1200V两个版本。
特性
- 低导通电阻改进了逆变器功率密度
- 650V - 17mΩ至120mΩ
- 1200V - 22mΩ至160mΩ
- 支持高速开关
- 体二极管的最短反向恢复时间
- 小Qg和寄生电容
- 高温操作 (Tjmax=175°C)
相关产品
Can be used to boost switching frequency, reducing the size of the external components.
Deliver ultra-fast switching speeds and low on-resistance in a broad range of package types.
在开关期间不会产生尾电流,因此动作较快,开关损耗更低。
Ultra-compact MOSFETs ideal for portable and wearable devices.
A broad lineup featuring low ON resistance ideal for a wide range of applications.
Allows evaluating the BD7682FJ-LB IC for AC/DC converters in industrial equipment.
Eval Board
Allows evaluating the BD7682FJ-LB IC for AC/DC converters in industrial equipment.
发布日期: 2016-10-11
| 更新日期: 2025-02-25