显示更多 
结果: 1,094
选择 图像 零件编号
 制造商
描述 数据表 供货情况 单价（含13%增值税） 根据您的数量，按照单价筛选表格中的结果。
数量 RoHS
congatec SMX8-Plus/HSP-B
congatec 散热片 Heat spreader solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.
数据表

congatec SMX8-X/i-CSP-B
congatec CPU与芯片冷却器 Passive cooling solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. All standoffs are with 2.7mm bore hole.
数据表
congatec SMX8-Plus/QC-2G eMMC16
congatec 模块化计算机 - COM SMARC 2.1 module with low-power 14nm NXP i.MX 8M Plus Quad processor. Features 4x ARM Cortex-A53 @1.8GHz +1x ARM Cortex-M7 + NPU, 2GB onboard LPDDR4 memory and 16GB onboard eMMC. Commercial grade temperature range from 0 C to 60 C.
数据表
congatec TC670/7305E
congatec 模块化计算机 - COM COM Express Type 6 Compact module based on Intel Celeron 7305E processor with 1 P-core 1.0GHz and 4 E-cores 0.9GHz, 8MB Intel Smart Cache, Intel UHD Graphics with 48EUs, Dual channel DDR5 4800 MT/s memory interface, Intel code name Alder Lake-U
congatec TC670/CSA-HP-B
congatec CPU与芯片冷却器 Standard active cooling solution for high performance COM Express module conga-TC670 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
congatec TC670/CSA-HP-T
congatec CPU与芯片冷却器 Standard active cooling solution for high performance COM Express module conga-TC670 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are M2.5mm threaded.
congatec TC670/CSP-HP-B
congatec CPU与芯片冷却器 Standard passive cooling solution for high performance COM Express module conga-TC670 with integrated heat pipes, 24.7mm height. All standoffs are with 2.7mm bore hole.
congatec TC670/CSP-HP-T
congatec CPU与芯片冷却器 Standard passive cooling solution for high performance COM Express module conga-TC670 with integrated heat pipes, 24.7mm height. All standoffs are M2.5mm threaded.
congatec TC670/HSP-HP-B
congatec 散热片 Standard heatspreader for high performance COM Express module conga-TC670 with integrated heat pipes, 11mm height. All standoffs are with 2.7mm bore hole.
congatec TC670/HSP-HP-T
congatec 散热片 Standard heatspreader for high performance COM Express module conga-TC670 with integrated heat pipes, 11mm height. All standoffs are M2.5mm threaded.
congatec TC670/i3-1215UE
congatec 模块化计算机 - COM COM Express Type 6 Compact module based on Intel Core i3-1215UE processor with 2 P-cores 1.2GHz up to 4.4GHz and 4 E-cores 0.9GHz up to 3.3GHz, 10MB Intel Smart Cache Intel UHD Graphics with 64EUs, Dual channel DDR5 4800 MT/s memory interface,
congatec TC670/i3-1220PE
congatec 模块化计算机 - COM COM Express Type 6 Compact module based on Intel Core i3-1220PE processor with 4 P-cores 1.5GHz up to 4.2GHz and 4 E-cores 1.1GHz up to 3.1GHz, 12MB Intel Smart Cache, Intel UHD Graphics with 48EUs, Dual channel DDR5 4800 MT/s memory interface, I
congatec TC670/i5-1245UE
congatec 模块化计算机 - COM COM Express Type 6 Compact module based on Intel Core i5-1245UE processor with 2 P-cores 2.5GHz up to 4.4GHz and 8 E-cores 1.1GHz up to 3.3GHz, 12MB Intel Smart Cache, Intel Iris Xe Graphics architecture with 80 EUs, Dual channel DDR5 4800 MT/s m
congatec TC670/i5-1250PE
congatec 模块化计算机 - COM COM Express Type 6 Compact module based on Intel Core i5-1250PE processor with 4 P-cores 1.7GHz up to 4.4GHz and 8 E-cores 1.2GHz up to 3.2GHz, 12MB Intel Smart Cache, Intel Iris Xe Graphics architecture with 80EUs, Dual channel DDR5 4800 MT/s me
congatec TC670/i7-1265UE
congatec 模块化计算机 - COM COM Express Type 6 Compact module based on Intel Core i7-1265UE processor with 2 P-cores 2.6GHz up to 4.7GHz and 8 E-cores 1.2GHz up to 3.5GHz, 12MB Intel Smart Cache, Intel Iris Xe Graphics architecture with 96 EUs, Dual channel DDR5 4800 MT/s m
congatec TC670/i7-1270PE
congatec 模块化计算机 - COM COM Express Type 6 Compact module based on Intel Core i7-1270PE processor with 4 P-cores 1.8GHz up to 4.5GHz and 8 E-cores 1.2GHz up to 3.3GHz, 18MB Intel Smart Cache, Intel Iris Xe Graphics architecture with 96 EUs, Dual channel DDR5 4800 MT/s m
congatec TCV2/CSA-HP-B
congatec CPU与芯片冷却器 Standard active cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
数据表
congatec TCV2/CSA-HP-T
congatec CPU与芯片冷却器 Standard active cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
数据表
congatec TCV2/CSP-HP-B
congatec CPU与芯片冷却器 Standard passive cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are with 2.7mm bore hole.
数据表
congatec TCV2/CSP-HP-T
congatec CPU与芯片冷却器 Standard passive cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are M2.5mm thread.
数据表
congatec TCV2/HSP-HP-T
congatec 散热片 Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread.
数据表
congatec conga-B7XD/CSA-Cu-B
congatec 模块配件 Standard active cooling solution for low and mid range performance COM Express Type 7 module conga-B7XD with integrated copper plate, 70mm 12V radial FAN and 27mm overall heat sink height. Intended for modules with TDP up to 35W * Cu = Copper plate *
congatec conga-B7XD/CSA-Cu-T
congatec 模块配件 conga-B7XD/CSA-Cu-T
congatec conga-B7XD/HSP-Cu-B
congatec 散热片 conga-B7XD/HSP-Cu-B
congatec conga-B7XD/HSP-Cu-T
congatec 散热片 conga-B7XD/HSP-Cu-T