散热片

结果: 137
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 产品 设计目的 安装风格 散热片材料 散热片样式 长度 宽度 高度
JUMPtec 散热片 HSP COMe-mAL10 E2 slim thread 52库存量
50预期 2026/9/22
最低: 1
倍数: 1
Heat Spreaders COMe-m(4)AL10(E2) Screw
JUMPtec 散热片 HSP COMe-mAL10 E2 through 4库存量
最低: 1
倍数: 1
Heat Spreaders COMe-mAL10 Through Hole
JUMPtec 散热片 HSP COMe-mAL10 E2 slim through 2库存量
最低: 1
倍数: 1
Heat Spreaders COMe-m(4)AL10(E2) Through Hole
JUMPtec 散热片 HSP COMe-mBT10 through 5库存量
最低: 1
倍数: 1
JUMPtec 散热片 HSP COMe-mAL10 E2 thread
52在途量
最低: 1
倍数: 1

Heat Spreaders COMe-m(4)AL10 (E2) Screw
JUMPtec 散热片 HSP COMe-mEL10 (E2) THREAD 无库存
最低: 1
倍数: 1

Heat Spreaders Threaded
JUMPtec 散热片 HSP SMARC-sXAL E2 无库存
最低: 1
倍数: 1

Heat Spreaders SMARC-sXAL
JUMPtec 散热片 HSP SMARC-sXELi 无库存交货期 31 周
最低: 1
倍数: 1

Heat Sinks
JUMPtec 散热片 HSP-Qseven-Q7AL2 无库存
最低: 1
倍数: 1

Heat Spreaders Qseven-Q7AL
JUMPtec 散热片 HSP COMe-mBT10 thread 无库存
最低: 1
倍数: 1

JUMPtec 散热片 HSP COMe-mBT10 slim through N/A
最低: 1
倍数: 1

JUMPtec 散热片 HSP COMe-bSL6 Cu-core through 无库存
最低: 1
倍数: 1

Heat Spreaders COMe-bSL6/bKL6/bCL6 Through Hole
JUMPtec 34006-0000-99-2
JUMPtec 散热片 HSP COMe-mBT10 slim thread 无库存交货期 22 周
最低: 1
倍数: 1

congatec 散热片 Standard Heatspreader for SMARC 2.0 module conga-SA5* For modules with IHS Intel Atom CPU* All stand-offs are bore hole 2.7mm

Heat Spreaders conga-SA5 Screw 82 mm 42 mm 6 mm
congatec 散热片 Standard heatspreader for Qseven module conga-QA5* For modules with IHS CPU* With bore hole 2.7mm stand-offs.

Heat Spreaders conga-QA5 Through Hole
congatec 散热片 Standard passive cooling for COM Express Mini Type10 module conga-MA5* Heatstack cooling for modules with standard CPU (open silicone die)* All stand-offs are M2.5 threaded

Heat Sinks conga-MA5 Screw
congatec 散热片 Standard heatspreader for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 13mm height. All standoffs are with 2.7mm bore hole.
Heat Spreaders 13 mm


congatec 散热片 Heat spreader solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. All standoffs are with 2.7mm bore hole.

Heat Spreaders SMARC Module
congatec 散热片 Standard heatspreader for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are with 2.7mm bore hole.

Heat Spreaders conga-MA7 Through Hole
congatec 散热片 Standard heatspreader for Qseven module conga-QA7 with lidded Intel Atom x6000E processors. All standoffs are with 2.7mm bore hole.
Heat Spreaders conga-QA7 Through Hole
congatec 散热片 Standard passive cooling for COM Express Mini Type10 module conga-MA5* For modules with IHS (lidded) CPU* All stand-offs are M2.5 threaded

Heat Sinks conga-MA5 Screw
congatec 散热片 Standard heatspreader for COM Express Mini Type10 module conga-MA5* For modules with IHS (lidded) CPU* All stand-offs are M2.5 threaded

Heat Spreaders conga-MA5 Screw
congatec HPC/cALP-HSP-HP-B
congatec 散热片 Standard heatspreader for COM-HPC module conga-HPC/cALP with integrated heat pipes, 13mm height. All standoffs are with 2.7mm bore hole.
Heat Spreaders COM-HPC Module 13 mm
JUMPtec 34014-0000-99-3
JUMPtec 散热片 HSP COMe-mRP10 Cu-core slim through

Heat Spreaders
congatec TCV2/HSP-HP-B
congatec 散热片 Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole.
Heat Spreaders COM Express Module 11 mm