3111 计算

模块化计算机 - COM COM HPC Size A module with Intel Core i3-1115GRE Processor, dual core with 3.0GHz (up to 3.9GHz), 6MB L2 cache, GT48 graphics and 3200MT/s dual channel DDR4 memory interface (28W TDP), no IPU, TCC, TSN, Inband ECC. Support for extended Temp.

工业箱式电脑 Industrial computer based Raspberry Pi CM5, with Wifi & Bluetooth,2GB RAM, 16GB Emmc,1 WiFi antenna,1 4G module,1 4G(US) antenna,2 RS232, 2 RS485and a supercapacitor module.

输入设备 Hall Effect Foot Pedal Switch

模块化系统 - SOM SOM-SMARC-MX8M-Plus with NXP i.MX8M Plus Quad, 8GB RAM, 64GB eMMC, HDMI, LVDS dual ch, 2x GbE, PCIe, Secure Element, Comm. temp.

模块化计算机 - COM COM Express Type 6 Compact module based on Intel Core i3-1115G4E 2-core processor with 2.2GHz up to 3.9GHz turbo boost, 6MB cache, Intel UHD Graphics with 48EU and 8 GByte dual channel LPDDR4X 4266 MT/s memory down (Intel Tiger Lake). Industrial t

模块化计算机 - COM COM HPC Size A module with Intel Core i3-1115G4E Processor, dual core with 3.0GHz (up to 3.9GHz), 6MB L2 cache, GT48 graphics and 3200MT/s dual channel DDR4 memory interface (28W TDP).

模块化计算机 - COM COM Express Type 6 Compact module based on Intel Core i3-1115GRE 2-core processor with 2.2GHz up to 3.9GHz turbo boost, 6MB cache, Intel UHD Graphics with 48EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake). Industrial tempera

模块化计算机 - COM COM Express Type 6 module 11th Intel Core i3-1115G4E dual core at 3.0GHz/3.9GHz

模块化计算机 - COM COM-HPC client module based on Intel Core i3-11100HE 4-core processor with 2.4GHz up to 4.4GHz turbo boost, 8MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) with Chipset HM570E.

模块化系统 - SOM SOM-SMARC-ADL w/ Intel N50 (6M Cache, up to 3.4 GHz), Dual Core - TDP 6W, 4GB LPDDR5 RAM, 32GB eMMC, 1x GbE, eDP, 2x DP++, no SERDES, TPM Q2.0, GP SPI, Comm Temp range

人机界面显示器及平板电脑 P512,i7,16A,8GP,W764,32SSD,DVI

人机界面显示器及平板电脑 Pnl15,i5,8G,No OS No HD,RS232