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Infineon Technologies XENSIV™ TLX49901-4M_EVALKIT评估套件
11/13/2026
11/13/2026
评估TLE49901-4M(汽车)和TLI49901-4M(工业)模拟线性霍尔传感器。
Nexperia GANC050 50mΩ 650V GaN FETs
11/12/2026
11/12/2026
Combines GaN HEMT technology with a low-voltage silicon MOSFET in a cascode configuration.
Nanopower Semiconductor nPZero G1S Stamp Module
11/11/2026
11/11/2026
Designed to simplify the evaluation and integration of the nPZero G1S power-saving IC.
Texas Instruments LP-EM-CC2755P10 LaunchPad Development Kit
11/11/2026
11/11/2026
Brings BL connectivity to the LaunchPad ecosystem with SimpleLink CC2755P10 wireless MCU.
Nanopower Semiconductor nPZero G1S ICs
11/11/2026
11/11/2026
Power-Saving ICs (PSICs) that enable ultra-low power autonomous operation in sensor-based systems.
Nanopower Semiconductor nPZero G1S Development Kit
11/11/2026
11/11/2026
Offers a powerful solution for testing the power-reduction capabilities of the nPZero IC.
RECOM Power RVB019 Current-Mode Buck Converters
11/10/2026
11/10/2026
Integrate control circuitry and power MOSFET on a single die using advanced BCD process technology.
RECOM Power RVP007 Transformer Drivers
11/10/2026
11/10/2026
Specifically designed for compact, low-standby-power, medium- and low-power isolated power supplies.
STMicroelectronics ST4E1651 Half-Duplex RS485 Transceiver
11/09/2026
11/09/2026
Differential line transceiver designed for reliable data communication in industrial networks.
Infineon Technologies my-d™ move NFC Type 2 Tag
11/09/2026
11/09/2026
NFC Type 2 Tag with password protection and preinitialized NDEF memory.
STMicroelectronics STM32G5 High-Performance Mixed-Signal MCUs
11/09/2026
11/09/2026
Built on 40nm technology and powered by an Arm® Cortex®-M33 core with TrustZone®.
Renesas Electronics RX74M 32-Bit High-Performance MCUs
11/09/2026
11/09/2026
These devices are high-performance IA/FA network-focused MCUs in the RX family.
STMicroelectronics TN4035HA-8GY Automotive Grade SCR Thyristor
11/09/2026
11/09/2026
High-performance switching device designed for automotive power and protection applications.
Infineon Technologies CoolSET™系统级封装 (SiP)
11/05/2026
11/05/2026
将高压开关(CoolMOS™ P7或CoolSiC™)与ZVS初级和SR次级控制器集成在一起。
M5Stack PaperMono e-paper Development Board
11/04/2026
11/04/2026
Built around low-power display, near-field identification, and long-range communication capabilities
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