新款嵌入式解决方案

Microchip Technology dsPIC33AK256MPS306 General Purpose Dual In-Line Module (DIM) (EV02E57A) is designed to demonstrate the capabilities of the dsPIC33AK256MPS306 family. The board operation requires using the dsPIC33 Curiosity Platform Development Board (EV74H48A) with the Microchip Technology dsPIC33AK256MPS306 General Purpose DIM (EV02E57A). The user must order the EV74H48A separately and can use it for a wide variety of applications.
-
Kingston LPDDR4x Low-Power DRAMsSupport data rates up to 4266 Mb/s and maintain backward compatibility with lower speeds.2026/7/10 -
Microchip Technology dsPIC33AK256MPS306 Motor Control DIM (EV22K90A)Used to evaluate the entire dsPIC33AK256MPS306 DSC family for motor control applications.2026/7/10 -
Microchip Technology dsPIC33AK256MPS306 General Purpose DIM (EV02E57A)Demonstrates the capabilities of the dsPIC33AK256MPS306 family of Digital Signal Controllers (DSCs).2026/7/10 -
Teltonika RUTC40 Global 4G Edge RoutersEnables smarter edge computing over 4G Cat 4 with a Telit modem.2026/7/9 -
Rosenberger RoProxCon Hybrid ReceiversInnovative connection system that enables contactless connections over a short distance.2026/7/9 -
M5Stack LoRaWAN-EU868 Wireless Communication ModuleBased on LoRa modulation technology, built for long-distance, low-power IoT application scenarios.2026/7/9 -
M5Stack PaperColor Development BoardFeatures a 4" E Ink Spectra 6 full-color e-paper display with 400x600 resolution.2026/7/9 -
STMicroelectronics EVLSTDRIVE631 演示板完整的三相逆变器,允许评估STDRIVE631P或STDRIVE631N特性。2026/7/9 -
Altera DK-A3W135BM16AEA Agilex™ 3 Development KitFor evaluating and prototyping high-performance Agilex™ 3 FPGA and SoC C-Series designs.2026/7/9 -
M5Stack Cardputer Mesh KitCommunication terminal kit integrates LoRa Mesh networking with global positioning capabilities.2026/7/8 -
InnoComm SOG52 & SOG72 Starter KitsProvide a practical platform for OSM development, embedded prototyping, and early-stage evaluation.2026/7/7 -
InnoComm Genio 360P/360 EVK Evaluation KitsIntegrate an M.2 Wi‑Fi®/BLUETOOTH® module and provide a high‑performance IoT platform.2026/7/7 -
STMicroelectronics EVLMG7 MASTERGAN7电源模块子板基于氮化镓 (GaN) 的电源模块,配备MASTERGAN7,可快速创建新拓扑结构。2026/7/7 -
Teltonika PR1MSJ21 4G Mobile Magnetic SMA AntennaDesigned to provide reliable cellular connectivity across the 700MHz to 2700MHz frequency range.2026/7/7 -
Texas Instruments UCC33411-Q1直流/直流模块采用集成变压器技术的汽车级隔离式直流/直流模块。2026/7/7 -
Teltonika RUT261 CAT 6 LTE RouterDesigned to provide fast and stable 4G connectivity using Cat 6 technology.2026/7/6 -
Cirque GlidePoint® Circle Trackpad Development KitsGets users up to speed with GlidePoint Circle Trackpads powered by Cirque Gen6 ASICs.2026/7/2 -
NXP Semiconductors MCXW236B-EXP附加板该扩展板可与广泛的MCU和MPU FRDM板卡实现连接。2026/7/2 -
Texas Instruments TRF0108SEP/SP 评估模块用于高达12GHz差分至单端信号转换的射频放大器EVM。2026/7/1 -
Axiomtek PICO570 Pico-ITX SBC with Intel® Core™ UltraUltra-compact solution for edge AI computing, integrates an 11 TOPS NPU to accelerate AI workloads.2026/6/30 -
Texas Instruments AMC43xxDVVEVM 评估模块AMC43xxDVV隔离式传感设备的评估模块。2026/6/30 -
Texas Instruments TMF00xxEVM 评估模块用于单线FRAM设备测试和存储器管理的USB评估模块。2026/6/30 -
Texas Instruments TPS62A212EVM-059 评估模块TPS62A2xx-Q1汽车降压转换器评估模块,输出电流高达12A。2026/6/30 -
TE Connectivity L000633-01全向桅杆安装天线提供450MHz至470MHz和901MHz至941MHz的双频段频率覆盖。2026/6/29 -
STMicroelectronics X-NUCLEO-NFC13A1 NFC读卡器扩展板此扩展板配置为支持读卡器模式下的所有五种NFC论坛标签类型。2026/6/29 -
