在下面选择类别，以查看过滤选项并缩小您的搜索。
 显示更多 
结果: 665
选择 图像 零件编号
 制造商
描述 数据表 供货情况 单价（含13%增值税） 根据您的数量，按照单价筛选表格中的结果。
数量 RoHS
congatec 模块化计算机 - COM COM-HPC Size D module based on Intel Xeon D1712TR 4-core processor with tbd GHz, 10MB cache and dual channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D LCC). Commercial temperature range.
数据表


congatec 散热片 Heat spreader solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. All standoffs are with 2.7mm bore hole.
数据表

congatec 散热片 Standard heatspreader for Qseven module conga-QA7 with lidded Intel Atom x6000E processors. All standoffs are with 2.7mm bore hole.
数据表
congatec 散热片 Standard passive cooling for COM Express Mini Type10 module conga-MA5* For modules with IHS (lidded) CPU* All stand-offs are M2.5 threaded
数据表

congatec CPU与芯片冷却器 Standard active cooling solution and integrated 12V fan for conga-JC370 (bore hole). 16mm fins, 21mm overall heat sink height and total height 27.3mm.
congatec cab-LVDS SHDR-40V, Open End
congatec 电脑线 Cable for LVDS Panel with JST SHDR-40V connector, 50 cm, Open End, matches also with conga-JC370.
数据表
congatec conga-HPC/mRLP-HSP-B
congatec 散热片 Standard heatspreader for COM-HPC module conga-HPC/mRLP. All standoffs are with 2.7mm bore hole.
数据表

congatec cab-LVDV-PWR-10-15
congatec 扁平数据线/ IDC数据线 POWER CABLE FOR LVDS TO DVI ADAPTER
数据表

congatec HPC/cALP-HSP-HP-B
congatec 散热片 Standard heatspreader for COM-HPC module conga-HPC/cALP with integrated heat pipes, 13mm height. All standoffs are with 2.7mm bore hole.
congatec 模块化计算机 - COM COM Express Type 7 Basic module based on Intel Atom C3308 2-core processor with 1.6 GHz, 4MB Cache and dual channel DDR4 2133 MT/s memory interface for up to 64 GByte (formerly Denverton). Features four 2.5GbE KX interface ports. Commercial tempera
数据表

congatec conga-TCR8/CSA-HP-B
congatec CPU与芯片冷却器 Standard active cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes and 12V fan. All standoffs are with 2.7mm bore hole.

congatec conga-TS170/i3-6100E CM236
congatec 模块化计算机 - COM COM Express Type 6 Basic module with Skylake-H Intel Core i3-6100E quad core processor with 2.7GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface.
数据表
congatec HPC/cALP-CSA-HP-B
congatec CPU与芯片冷却器 Standard active cooling solution for COM-HPC module conga-HPC/cALP with integrated heat pipes, 29mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
congatec HPC/sILH-CSA-HP-T
congatec CPU与芯片冷却器 Standard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Threaded mounting with threaded standoffs M2.5.
数据表
congatec conga-HPC/mRLP-CSA-B
congatec CPU与芯片冷却器 Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
数据表

congatec conga-HPC/mRLP-CSP-B
congatec CPU与芯片冷却器 Standard passive cooling solution for COM-HPC module conga-HPC/mRLP with 24.2mm overall heat sink height. All standoffs are with 2.7mm bore hole.
数据表

congatec TCV2/HSP-HP-B
congatec 散热片 Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole.
数据表
congatec 模块化计算机 - COM COM HPC Size A module with Intel Core i3-1115GRE Processor, dual core with 3.0GHz (up to 3.9GHz), 6MB L2 cache, GT48 graphics and 3200MT/s dual channel DDR4 memory interface (28W TDP), no IPU, TCC, TSN, Inband ECC. Support for extended Temp.
数据表
congatec 模块化计算机 - COM COM Express Type 7 Basic module based on AMD embedded EPYC 3255 8-core processor (single die) with 2.5GHz up to 3.1 GHz turbo boost, 16MB L3 cache and dual channel DDR4 2666 MT/s memory interface (formerly Snowy Owl).
数据表

congatec 散热片 Standard Heat spreader for SMARC 2.0 module conga-SA7* For modules with lidded Intel Atom processor* All stand-offs are with 2.7mm bore hole
数据表
更多信息可用
congatec 模块化计算机 - COM COM HPC Size A module with Intel Core i7-1185GRE Processor, quad core with 2.8GHz (up to 4.4GHz), 12MB L2 cache, GT96 graphics and 3200MT/s dual channel DDR4 memory interface (28W TDP), no IPU, TCC, TSN, Inband ECC. Support for extended Temp.
数据表

congatec 模块化计算机 - COM COM-HPC client module based on Intel Xeon Processor W-11865MLE 8-core processor with 1.5GHz up to 4.5GHz turbo boost, 24MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) with Chipset
数据表

congatec 模块化计算机 - COM SMARC 2.0 module with advanced low-power 14nm NXP i.MX 8M Mini Quad processor. Features 4x ARM Cortex-A53 @1.8GHz and 1x ARM Cortex-M4, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. DisplayPort interface instead of LVDS. Commercial temperature ran
数据表

congatec 开发板与工具包 - x86 EVALUATION CARRIER BRD COM EXP TYPE 10
数据表

congatec 开发板与工具包 - x86 3.5 Carrier Board for SMARC 2.0 modules with x86 CPUDimensions are 146mm x 102 mm (5.74" x 4.02")Operating Temperature: 0 C to 60 C (commercial)
数据表
更多信息可用