多协议模块

结果: 245
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 封装
Microchip Technology 多协议模块 ATWILC3000 802.11 b/g/n + Bluetooth 5 Module Chip Antenna 2,225库存量
最低: 1
倍数: 1

2.4 GHz 18.5 dBm SDIO, SPI, UART 1.62 V 3.6 V - 40 C + 85 C Chip 22.4 mm x 14.7 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
u-blox 多协议模块 M.2 card with MAYA-W161, in tray 277库存量
最低: 1
倍数: 1

MAYA-W1 2.4 GHz, 5 GHz 18 dBm I2S, PCIe, SDIO, UART 1.8 V 3.3 V - 40 C + 85 C u.FL 22 mm x 30 mm x 2.8 mm BLE, Bluetooth 5.2 802.11 a/b/g/n Tray
AAEON UP 多协议模块 Quectel 4G LTE CAT4 Global module EG-25G Mini PCIe with RF Cable 150mm and LTE Full band & GPS Antenna 33库存量
最低: 1
倍数: 1

33 dBm PCIe, UART, USB 3.3 V 3.3 V - 40 C + 80 C u.FL 50 mm x 30 mm x 4.9 mm LTE GNSS Bulk
HMS Networks 多协议模块 Anybus Wireless Bolt (Sunbolt) 3库存量
最低: 1
倍数: 1

Anybus Wireless 2.4 GHz, 5 GHz 18 dBm Ethernet 19 V 36 V - 40 C + 65 C Integrated 68 mm x 75 mm Bluetooth 2.1, 4.0 802.11 a/b/g/n/d Bulk

Espressif Systems 多协议模块 SMD module, ESP32-D0WD-V3, ESP32 ECO V3, 4 MB SPI flash, IPEX antenna connector, -40 C +105 C 2,512库存量
650在途量
最低: 1
倍数: 1

2.4 GHz 19.5 dBm I2C, I2S, PWM, SDIO, SPI, UART 3 V 3.6 V - 40 C + 105 C External 18 mm x 19 mm x 3.2 mm BLE, Bluetooth 4.2 802.11 b/g/n Tray

Silicon Labs 多协议模块 Wireless bluetooth SiP module, Secure Boot with Root of Trust and Secure Loader(RTSL), MVP, 78 MHz, 10 dBm 1,310库存量
最低: 1
倍数: 1

xGM240S 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C Built-In, RF 7 mm x 7 mm x 1.18 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Tray
Silex Technology 多协议模块 [Sample Pack] The SX-SDMAX-M2 is an M.2 2230 card that implements the SX-SDMAX-2530S. It is a 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module using the NXP IW611 chipset.It features an MHF-I connector as an interface fo 7库存量
最低: 1
倍数: 1

SX-SDMAX 2.4 GHz/5 GHz Bluetooth, WiFi, UART 3.14 V 3.46 V - 40 C + 85 C 22 mm x 4.45 mm x 30 mm Bulk
u-blox 多协议模块 M.2 card with JODY-W263, in tray 196库存量
最低: 1
倍数: 1

JODY-W2 2.4 GHz, 5 GHz 18 dBm GPIO, SDIO, UART 1.8 V 3.3 V - 40 C + 85 C u.FL 22 mm x 30 mm x 4.2 mm Bluetooth 5.2 Tray
Ezurio 多协议模块 60 Series, Sterling Module w/u.FL, PCIE/UART 195库存量
最低: 1
倍数: 1

60-2230C 2.4 GHz, 5 GHz 18 dBm SDIO, UART 2.97 V 3.63 V - 40 C + 85 C u.FL 22 mm x 30 mm x 3.3 mm Bluetooth 5.1 802.11 a/b/g/n/ac Tray
Espressif Systems 多协议模块 SMD module, ESP32-S3R2 with 2 MB PSRAM die inside, 4 MB SPI flash, IPEX antenna connector.

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.0 802.11 b/g/n Bulk
Embedded Artists 多协议模块 1YM M.2 Wi-Fi 5 a/b/g/n/ac MU-MIMO, Bluetooth 5.2 with 88W8997 and LBEE5XV1YM 51库存量
最低: 1
倍数: 1

2.4 GHz, 5 GHz 4-Wire UART, PCIe 3 V 3.6 V - 30 C + 85 C u.FL 22 mm x 30 mm Bluetooth 5.2 802.11 a/b/g/n/ac Bulk
Inventek 多协议模块 802.11a/b/g/n serial-to-WiFi and BT 4.0 combo module with integrated TCP/IP stack. 2.4 and 5 GHz Chip Antenna. 2MB External Flash. Inventek AT Commands (IWIN) firmware and Cypress WICED compatible. Certified FCC/IC/CE 17库存量
196预期 2026/6/15
最低: 1
倍数: 1

ISM43340 2.4 GHz, 5 GHz 19 dBm SPI, UART 3.3 V 3.3 V - 40 C + 85 C Chip 14.5 mm x 34 mm x 2.5 mm Bluetooth 802.11 a/b/g/n Tray
Pulse Electronics 多协议模块 USB 802.11 b/g/n BT module 746库存量
最低: 1
倍数: 1

TWR 2.4 GHz 14 dBm, 16 dBm USB 2.0 3 V 3.6 V - 5 C + 60 C 14.7 mm x 10.8 mm x 3.2 mm BLE, Bluetooth 802.11 b/g/n Tray
Silex Technology 多协议模块 [Sample Pack] SX-SDMAX-2530C is a board-to-board connector type board implementing the SX-SDMAX-2530S. It is a 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module using the NXP IW611 chipset.It includes an MHF-I connector f 10库存量
最低: 1
倍数: 1

SX-SDMAX 2.4 GHz/5 GHz Bluetooth, WiFi, UART 3.14 V 3.46 V - 40 C + 85 C 24 mm x 24 mm x 4.45 mm Bulk
HMS Networks 多协议模块 Wireless Bolt-CAN Interface 2库存量
最低: 1
倍数: 1

Anybus Wireless 2.4 GHz, 5 GHz 18 dBm CAN, Ethernet, WiFi 9 V 30 V - 40 C + 65 C Built-In 68 mm x 75 mm Bluetooth 2.1 802.11 a/b/g/n/d Bulk
Adafruit 多协议模块 ESP32-C6-WROOM-1-N8 Engineering Module - 8 MB Quad SPI Flash - PCB Antenna 10库存量
最低: 1
倍数: 1

Bulk
Ezurio 多协议模块 Module, Sterling LWB+, M.2, Key E, SDIO, UART 59库存量
最低: 1
倍数: 1

Sterling-LWB+ 2.4 GHz USART 3.2 V 4.8 V - 40 C + 85 C MHF4 Bluetooth 5.2 WiFi 4, 802.11 b/g/n Tray
Microchip Technology 多协议模块 ATWINC3400 802.11 b/g/n + Bluetooth 5 Module U.FL Antenna 815库存量
最低: 1
倍数: 1
2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C u.FL 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 Tray
Telit Cinterion 多协议模块 344库存量
最低: 1
倍数: 1

1.4 MHz 23 dBm I2C, SPI, UART 2.2 V 4.5 V - 40 C + 85 C 18 mm x 15 mm Cellular, NBIoT, LTE GPS Tray
Telit Cinterion 多协议模块 392库存量
最低: 1
倍数: 1

1.4 MHz 23 dBm I2C, SPI, UART 2.2 V 4.5 V - 40 C + 85 C 18 mm x 15 mm Cellular, NBIoT, LTE GPS Tray
Silicon Labs 多协议模块 MGM13S02F512GN Mighty Gecko SiP Module for Zigbee and Thread 802.15.4 Mesh and Multiprotocol Connectivity 260库存量
最低: 1
倍数: 1

MGM13S 2.4 GHz 10 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 85 C RF 6.5 mm x 6.5 mm x 1.4 mm Bluetooth Thread, Zigbee Tray
InnoPhase IoT 多协议模块 WiFi/BLE5/MCU Module w/ PCB Antenna 385库存量
最低: 1
倍数: 1
2.4 GHz 17.5 dBm SPI, UART 2.6 V 3.6 V - 40 C + 85 C PCB 12.8 mm x 20 mm x 2.5 mm BLE 5.0 802.11 b/g/n Tray
Silicon Labs 多协议模块 802.15.4 Module, SiP, Secure Boot with Root of Trust and Secure Loader (RTSL), +6.5 dBm, 2.4 GHz, 768kB flash, 64kB RAM, -40 to +105 C, 26 GPIO, Certified 772库存量
最低: 1
倍数: 1

MGM270S 76.8 MHz - 40 C + 105 C 6.5 mm x 6.5 mm x 1.3 mm Bluetooth Tray
Telit Cinterion 多协议模块 181库存量
392预期 2026/10/23
最低: 1
倍数: 1

1.4 MHz 23 dBm I2C, SPI, UART 2.6 V 4.5 V - 40 C + 85 C 18 mm x 15 mm x 2.6 mm Cellular, NBIoT, LTE GPS Tray
Silex Technology 多协议模块 2x2 Dual Band 802.11 ac WLAN+BT PCIe 87库存量
101预期 2026/8/3
最低: 1
倍数: 1

SX-PCEAC2 2.4 GHz, 5 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 70 C MHF4 30 mm x 26.8 mm x 3.4 mm Bluetooth 5.0 802.11 a/b/g/n/ac Bulk