|
|
散热片 HSP COMe-mAL10 E2 slim thread
- 34009-0000-99-2
- JUMPtec
-
1:
¥218.8697
-
60库存量
-
50预期 2026/9/22
|
Mouser 零件编号
168-34009-0000-99-2
|
JUMPtec
|
散热片 HSP COMe-mAL10 E2 slim thread
|
|
60库存量
50预期 2026/9/22
|
|
最低： 1
倍数： 1
|
|
|
|
|
CPU与芯片冷却器 COMe Active Uni Cooler (w/o HSP)
- 36099-0000-99-0
- JUMPtec
-
1:
¥343.6895
-
42库存量
|
Mouser 零件编号
168-36099-0000-99-0
|
JUMPtec
|
CPU与芯片冷却器 COMe Active Uni Cooler (w/o HSP)
|
|
42库存量
|
|
最低： 1
倍数： 1
|
|
|
|
|
散热片 HSP COMe-mBT10 through
- 34006-0000-99-1
- JUMPtec
-
1:
¥165.432
-
6库存量
|
Mouser 零件编号
168-34006-0000-99-1
|
JUMPtec
|
散热片 HSP COMe-mBT10 through
|
|
6库存量
|
|
最低： 1
倍数： 1
|
|
|
|
|
散热片 HSP COMe-mBT10 thread
- 34006-0000-99-0
- JUMPtec
-
1:
¥165.432
-
19库存量
|
Mouser 零件编号
168-34006-0000-99-0
|
JUMPtec
|
散热片 HSP COMe-mBT10 thread
|
|
19库存量
|
|
最低： 1
倍数： 1
|
|
|
|
|
散热片 HSP COMe-mAL10 E2 slim through
- 34009-0000-99-3
- JUMPtec
-
1:
¥175.7715
-
3库存量
|
Mouser 零件编号
168-34009-0000-99-3
|
JUMPtec
|
散热片 HSP COMe-mAL10 E2 slim through
|
|
3库存量
|
|
最低： 1
倍数： 1
|
|
|
|
|
CPU与芯片冷却器 HSK COMe-Basic passive (w/o HSP)
- 38025-0000-99-0C06
- JUMPtec
-
1:
¥247.0745
-
无库存交货期 28 周
|
Mouser 零件编号
168-38025-0000990C06
|
JUMPtec
|
CPU与芯片冷却器 HSK COMe-Basic passive (w/o HSP)
|
|
无库存交货期 28 周
|
|
最低： 1
倍数： 1
|
|
|
|
|
散热片 HSP COMe-mAL10 E2 thread
- 34009-0000-99-0
- JUMPtec
-
1:
¥374.8662
-
53在途量
|
Mouser 零件编号
168-34009-0000-99-0
|
JUMPtec
|
散热片 HSP COMe-mAL10 E2 thread
|
|
53在途量
在途量:
3 预期 2026/11/17
50 预期 2026/12/14
|
|
最低： 1
倍数： 1
|
|
|
|
|
散热片 HSP COMe-mAL10 E2 through
- 34009-0000-99-1
- JUMPtec
-
1:
¥204.0554
-
4预期 2026/11/9
|
Mouser 零件编号
168-34009-0000-99-1
|
JUMPtec
|
散热片 HSP COMe-mAL10 E2 through
|
|
4预期 2026/11/9
|
|
最低： 1
倍数： 1
|
|
|
|
|
CPU与芯片冷却器 HSP COMe-cAP6 Cu-core threaded
- 36035-0000-99-0
- JUMPtec
-
1:
¥475.617
-
2预期 2026/8/14
|
Mouser 零件编号
168-36035-0000-99-0
|
JUMPtec
|
CPU与芯片冷却器 HSP COMe-cAP6 Cu-core threaded
|
|
2预期 2026/8/14
|
|
最低： 1
倍数： 1
|
|
|
|
|
CPU与芯片冷却器 HSK COMe-Basic active (w/o HSP)
- 38025-0000-99-0C05
- JUMPtec
-
1:
¥375.9397
-
28预期 2026/7/10
|
Mouser 零件编号
168-38025-0000990C05
|
JUMPtec
|
CPU与芯片冷却器 HSK COMe-Basic active (w/o HSP)
|
|
28预期 2026/7/10
|
|
最低： 1
倍数： 1
|
|
|
|
|
散热片 HSP COMe-mBT10 slim through
- 34006-0000-99-3
- JUMPtec
-
1:
¥144.753
-
无库存
|
Mouser 零件编号
168-34006-0000-99-3
|
JUMPtec
|
散热片 HSP COMe-mBT10 slim through
|
|
无库存
|
|
最低： 1
倍数： 1
|
|
|
|
|
散热片 HSP COMe-mEL10 (E2) THREAD
- 34013-0000-99-0
- JUMPtec
-
1:
¥196.4505
-
无库存
|
Mouser 零件编号
168-34013-0000-99-0
|
JUMPtec
|
散热片 HSP COMe-mEL10 (E2) THREAD
|
|
无库存
|
|
最低： 1
倍数： 1
|
|
|
|
|
CPU与芯片冷却器 COMe Passive Uni Cooler (w/o HSP)
- 36099-0000-99-1
- JUMPtec
-
1:
¥144.753
-
N/A
|
Mouser 零件编号
168-36099-0000-99-1
|
JUMPtec
|
CPU与芯片冷却器 COMe Passive Uni Cooler (w/o HSP)
|
|
N/A
|
|
最低： 1
倍数： 1
|
|
|
|
|
散热片 HSP SMARC-sXAL E2
- 51008-0000-99-1
- JUMPtec
-
1:
¥196.4505
-
无库存
|
Mouser 零件编号
168-51008-0000-99-1
|
JUMPtec
|
散热片 HSP SMARC-sXAL E2
|
|
无库存
|
|
最低： 1
倍数： 1
|
|
|
|
|
散热片 HSP SMARC-sXELi
- 51017-0000-99-1
- JUMPtec
-
1:
¥320.5245
-
无库存交货期 18 周
|
Mouser 零件编号
168-51017-0000-99-1
|
JUMPtec
|
散热片 HSP SMARC-sXELi
|
|
无库存交货期 18 周
|
|
最低： 1
倍数： 1
|
|
|
|
|
散热片 HSP-Qseven-Q7AL2
- 81004-0000-99-1
- JUMPtec
-
1:
¥134.4135
-
无库存
|
Mouser 零件编号
168-81004-0000-99-1
|
JUMPtec
|
散热片 HSP-Qseven-Q7AL2
|
|
无库存
|
|
最低： 1
倍数： 1
|
|
|
|
|
散热片 HSP COMe-bSL6 Cu-core threaded
- 38030-0000-99-0
- JUMPtec
-
1:
¥413.58
-
无库存交货期 5 周
-
寿命结束
|
Mouser 零件编号
168-38030-0000-99-0
寿命结束
|
JUMPtec
|
散热片 HSP COMe-bSL6 Cu-core threaded
|
|
无库存交货期 5 周
|
|
最低： 1
倍数： 1
|
|
|
|
|
散热片 HSP COMe-bSL6 Cu-core through
- 38030-0000-99-1
- JUMPtec
-
1:
¥351.543
-
无库存
-
寿命结束
|
Mouser 零件编号
168-38030-0000-99-1
寿命结束
|
JUMPtec
|
散热片 HSP COMe-bSL6 Cu-core through
|
|
无库存
|
|
最低： 1
倍数： 1
|
|
|
|
|
散热片 HSP COMe-mBT10 slim thread
JUMPtec 34006-0000-99-2
- 34006-0000-99-2
- JUMPtec
-
1:
¥248.148
-
无库存交货期 22 周
|
Mouser 零件编号
168-34006-0000-99-2
|
JUMPtec
|
散热片 HSP COMe-mBT10 slim thread
|
|
无库存交货期 22 周
|
|
最低： 1
倍数： 1
|
|
|
|
|
散热片 Standard heatspreader (Heatstack Solution) for Qseven module conga-QMX6 with CPU in NON-LIDDED FCBGA Package.Threaded version (standoffs, M2.5)Intended for following QMX6 modules: * conga-QMX6/DC-1G eMMC4 (P/N 016102A) * conga-QMX6/QC-1G eMMC4 (P/N 0
- conga-QMX6/HSP3-T
- congatec
-
受限供货情况
|
Mouser 零件编号
787-016162
|
congatec
|
散热片 Standard heatspreader (Heatstack Solution) for Qseven module conga-QMX6 with CPU in NON-LIDDED FCBGA Package.Threaded version (standoffs, M2.5)Intended for following QMX6 modules: * conga-QMX6/DC-1G eMMC4 (P/N 016102A) * conga-QMX6/QC-1G eMMC4 (P/N 0
|
|
|
|
|
|
|
|
|
散热片 Standard passive cooling for Qseven module conga-QA3. All stand-offs are M2.5 threaded.
- conga-QA3/CSP-T
- congatec
-
受限供货情况
|
Mouser 零件编号
787-015192
|
congatec
|
散热片 Standard passive cooling for Qseven module conga-QA3. All stand-offs are M2.5 threaded.
|
|
|
|
|
|
|
|
|
散热片 Standard Heatspreader for SMARC 2.0 module conga-SA5* For modules with IHS Intel Atom CPU* All stand-offs are bore hole 2.7mm
- conga-SA5/i-HSP-B
- congatec
-
受限供货情况
|
Mouser 零件编号
787-050053
|
congatec
|
散热片 Standard Heatspreader for SMARC 2.0 module conga-SA5* For modules with IHS Intel Atom CPU* All stand-offs are bore hole 2.7mm
|
|
|
|
|
|
|
|
|
CPU与芯片冷却器 Passive cooling solution for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are with 2.7mm bore hole.
- conga-MA7/i-CSP-B
- congatec
-
受限供货情况
|
Mouser 零件编号
787-049450
|
congatec
|
CPU与芯片冷却器 Passive cooling solution for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are with 2.7mm bore hole.
|
|
|
|
|
|
|
|
|
散热片 Standard heatspreader for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are with 2.7mm bore hole.
- conga-MA7/i-HSP-B
- congatec
-
受限供货情况
|
Mouser 零件编号
787-049454
|
congatec
|
散热片 Standard heatspreader for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are with 2.7mm bore hole.
|
|
|
|
|
|
|
|
|
CPU与芯片冷却器 Passive cooling solution for COM Express Compact module conga-TCA7 with lidded Intel Atom processor. thread
- conga-TCA7/i-CSP-T
- congatec
-
受限供货情况
|
Mouser 零件编号
787-049353
|
congatec
|
CPU与芯片冷却器 Passive cooling solution for COM Express Compact module conga-TCA7 with lidded Intel Atom processor. thread
|
|
|
|
|
|
|
