congatec 热管理产品

结果: 253
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS
congatec conga-HPC/mRLP-CSA-T
congatec CPU与芯片冷却器 Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm threaded.

congatec conga-HPC/mRLP-CSP-B
congatec CPU与芯片冷却器 Standard passive cooling solution for COM-HPC module conga-HPC/mRLP with 24.2mm overall heat sink height. All standoffs are with 2.7mm bore hole.

congatec conga-HPC/mRLP-HSP-B
congatec 散热片 Standard heatspreader for COM-HPC module conga-HPC/mRLP. All standoffs are with 2.7mm bore hole.

congatec 散热片 * Standard passive cooling for Qseven module conga-QA5* For modules with IHS CPU* All stand-offs are M2.5 threaded

congatec 散热片 * Standard heatspreader for Qseven module conga-QA5* For modules with IHS CPU* All stand-offs are M2.5 threaded.

congatec 散热片 Standard heatspreader for Qseven module conga-QA7 with lidded Intel Atom x6000E processors. All standoffs are M2.5x0.45p threaded.
congatec 散热片 Standard heatspreader for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are M2.5mm thread.
congatec 散热片 * Standard heatspreader for COM Express Mini Type10 module conga-MA5* For modules with IHS (lidded) CPU* All stand-offs are bore hole 2.7mm

congatec 散热片 *Heatspreader for Pico ITX board conga-PA7*For CPUs with standard silicone die*Four stand-offs M2.5 threaded
congatec CPU与芯片冷却器 Passive cooling solution for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are M2.5 threaded

congatec 散热片 * Standard Heatspreader for SMARC 2.0 module conga-SA5* For modules with IHS Intel Atom CPU* All stand-offs are bore hole 2.7mm

congatec 散热片 Standard heatspreader for high performance COM Express module conga-TC570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole.
JUMPtec 散热片 HSP COMe-mEL10 (E2) THROUGH

JUMPtec 散热片 HSP COMe-mEL10 (E2) SLIM THREAD

JUMPtec 散热片 HSP COMe-mEL10 (E2) SLIM THROUGH

JUMPtec 散热片 HSP COMe-cSL6, thread

JUMPtec 散热片 HSP COMe-cEL6 (E2) THREAD

JUMPtec 散热片 HSP COMe-cEL6 (E2) THROUGH

JUMPtec CPU与芯片冷却器 HSP COMe-cAP6 Cu-core through

JUMPtec CPU与芯片冷却器 COMe Passive Uni Cooler2 slim (w/o HSP)

JUMPtec CPU与芯片冷却器 COMe Passive Uni Cooler2 (w/o HSP)

JUMPtec CPU与芯片冷却器 HSP COMe-bV26 Cu-core threaded

JUMPtec CPU与芯片冷却器 HSP COMe-bV26 Cu-core through

JUMPtec CPU与芯片冷却器 HSP COMe-bTL6 Cu-core threaded

JUMPtec CPU与芯片冷却器 HSP COMe-bTL6 Cu-core through