新款模块化计算机 - COM

Advantech SOM-6873 AMD Ryzen™ 8000 COM Express® Type 6模块专为游戏应用而设计,采用紧凑型Type 6引脚分配设计。SOM-6873模块由高性能AMD Ryzen嵌入式8000处理器提供动力。该主板的功能集经过优化,可升级基于Com Express的游戏平台,配备4个SATA接口和4个显示器接口。双通道DDR5 SO-DIMM插座最高可安装96GB RAM,而高速I/O包括2.5GbE、PCIe Gen 4、USB 3.2 Gen2和SATA3.0。Advantech SOM-6873 AMD Ryzen 8000 COM Express Type 6模块支持嵌入式软件API、iManager控制台和DeviceOn平台。
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Advantech SOM-6873 AMD Ryzen 8000 COM Express Type 6模块专为游戏应用而设计,采用紧凑型Type 6引脚分配设计。2025/8/25 -
Ka-Ro Electronics QSMP2 Solder-Down Computer On ModulesFeature up to 60x 3.3V general purpose I/O and LVDS display interface.2025/3/21 -
Advantech SOM-7533 COM Express® Mini Type10模块搭载Intel® Core™ i3、N系列和Atom® x7000系列处理器 (Alder Lake-N/Amston Lake)。2025/1/30 -
Ka-Ro Electronics QSMP135 Computer-on-ModuleA solder-down System-on-Module featuring an STM32MP135C 650MHz Arm® Cortex®-A7 processor.2024/7/1 -
ADLINK Technology Nvidia RTX 嵌入式 MXM 模块采用基于Ampere架构的NVIDIA嵌入式显卡。2024/6/6 -
ADLINK Technology Nvidia Quadro T1000 嵌入式 MXM 模块采用基于Thing™ 架构的NVIDIA嵌入式显卡。2024/6/3 -
DFRobot LattePanda Mu Micro x86计算模块采用Intel N100四核处理器、8GB LPDDR5内存和64GB存储。2024/5/28 -
Advantech ROM-2620 OSM 1.1模块化计算机OSM 1.1模块化计算机,由NXP i.MX 8ULP SoC提供支持。2024/5/10 -
NexCOBOT ICES622X Computer-On-Module (COM)COM Express Type 6 compact-size module that features Intel® Atom™ X6000 processors.2024/3/23 -
NexCOBOT SMC250 SMARC 2.1 Computer-On-Module (COM)Features an Intel Atom® x5-E3940 Quad Core processor in an 82mm x 50mm short-size module dimension.2024/1/17 -
Ka-Ro Electronics QFN Style Solder-Down Computer On ModulesSingle-sided assembled in a small square size of 27mm and a height of 2.6mm.2024/1/7 -
Ka-Ro Electronics TXMP2 Computer On ModulePart of the TX family and includes an STM32MP255 processor with 1.5 GHz dual Arm® Cortex®-A35.2024/1/7 -
Ka-Ro Electronics TX91 Computer On ModuleComplete computer implemented on a board smaller than a credit card.2024/1/7 -
ADLINK Technology Express-RLP COM Express基本尺寸Type 6模块6型基本尺寸模块,基于第13代Intel® Core™ 移动处理器。2023/12/21 -
NexCOBOT ICES676S Computer-On-Module (COM)COM Express Type 6-pinouts basic module that supports 12/13th Generation Intel® Core™ processors.2023/11/9 -
ADLINK Technology Express-ADP 6型模块采用具有创新混合架构的第12代Intel® Core™处理器。2023/8/23 -
ADLINK Technology Express-ID7模块基于Intel® Xeon® D-1700处理器,集成高达4x 10G的高速以太网2023/8/23 -
Ka-Ro Electronics TX93 Computer-on-Module (COM)Features a 1.5GHz Dual ARM® Cortex®-A55 processor based on the NXP i.MX 93.2023/7/20 -
Ka-Ro Electronics QS93 QFN-Style Solder-Down Computer-on-Module100-pin QFN lead-styled module measures 27mm2 x 2.6mm in height and provides a single-sided assembly2023/7/20 -
congatec COMe-cAP6 COM Express® w/ Intel® Core™ ProcessorsBoasts the power of 12th Generation Intel Core Processors, supporting up to 64GByte LPDDR5 memory.2023/4/1 -
ADLINK Technology Express-TL COM Express基本尺寸Type 6模块基于第11代Intel® Core™ 、Xeon® W和Celeron® 6000处理器。2023/2/2 -
ADLINK Technology cExpress-TL COM Express Type 6模块支持PCI Express第4代 (16GT/s) 和四个USB 3.2端口(传输速率高达10Gb/s)。2023/2/2 -
congatec COMe-bID7 COM Express® w/ Intel® XEON® ProcessorsA server-grade platform with exceptional performance.2022/9/1 -
congatec 3.5” SBC with AMD RYZEN™ V1000/R1000 ProcessorsA compact single-board computer that excels in 4K playback.2022/9/1 -
Ka-Ro Electronics QSRZ Computer-on-ModulesOffers a Renesas RZ/G2L Dual 1.2GHz Arm® Cortex®-A55 200MHz Arm Cortex-M33 processor.2022/7/1 -
