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数量 RoHS
JUMPtec 68007-0000-99-1C01
JUMPtec 模块化计算机 - COM JUMPtec HSK COMe-bDV7 passive through
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产品评论
无库存
最低： 1
倍数： 1

JUMPtec 97020-0424-CWL6
JUMPtec 存储器模块 DDR4-2400 SODIMM 4G
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无库存
最低： 1
倍数： 1
congatec 模块化计算机 - COM COM Express Type 6 Compact module with Intel Core i3-7100U dual core processor with 2.4GHz, 3MB Intel Smart Cache , GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).
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congatec 模块化计算机 - COM COM Express Type 6 Compact module with Intel Celeron 3955U dual core processor with 2.0GHz, 2MB L2 cache, 2133MT/s dual channel DDR4 memory interface
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congatec CPU与芯片冷却器 Passive cooling solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.
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congatec 模块化计算机 - COM COM-HPC Size D module based on Intel Xeon D1712TR 4-core processor with tbd GHz, 10MB cache and dual channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D LCC). Commercial temperature range.
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congatec 散热片 * Passive cooling for SMARC 2.0 module conga-SA5* For modules with IHS Intel Atom CPU* All stand-offs are bore hole 2.7mm
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congatec 模块化计算机 - COM QSEVEN INTEL ATOM E3845 BAY TRAIL
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congatec 开发板与工具包 - x86 EVALUATION CARRIER BRD COM EXP TYPE 10
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congatec conga-TEVAL3/COMe 3.1
congatec 开发板和工具包 - 其他处理器 congatec COM Express Type 6 evaluation carrier compliant to COM Express 3.1 specification. Industrial temperature range. From -40 C to 85 C
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congatec 散热片 Standard passive cooling for Qseven module conga-QA3. All stand-offs are M2.5 threaded.
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congatec 模块化计算机 - COM Qseven 2.0 module based on Intel Atom x7 E3950 SoC (Itemp Quad-core, 12W TDP, CPU freq. 1.6/2.0GHz, GPU 18EU freq. 500/650MHz) with on-board memory 8GB DDR3L-1866 and 32GB eMMC.
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congatec 散热片 Heat spreader solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. All standoffs are with 2.7mm bore hole.
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congatec 开发板和工具包 - ARM 3.5 Carrier Board for SMARC 2.0 modules with ARMDimensions are 146mm x 102 mm (5.74" x 4.02")Operating Temperature: 0 C to 60 C (commercial)
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更多信息可用

congatec 模块化计算机 - COM COM Express Type 6 Compact module based on Intel Core i7-8665UE 4-core processor with 1.7GHz up to 4.4GHz turbo boost, 8MB L2 cache, Intel UHD Graphics 620 and dual channel DDR4 2400 MT/s memory interface (formerly Whiskey Lake).
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congatec 模块化计算机 - COM COM-HPC client module based on Intel Xeon Processor W-11865MLE 8-core processor with 1.5GHz up to 4.5GHz turbo boost, 24MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) with Chipset
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congatec 模块化计算机 - COM Qseven module with Intel Atom E3845 quad core processor with 1.91GHz, 2MB L2 cache, 4GB 1333MT/s DDR3L onboard dual channel memory. No onboard eMMC.
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更多信息可用

congatec 散热片 Standard heatspreader (Heatstack Solution) for Qseven module conga-QMX6 with CPU in NON-LIDDED FCBGA Package.Threaded version (standoffs, M2.5)Intended for following QMX6 modules: * conga-QMX6/DC-1G eMMC4 (P/N 016102A) * conga-QMX6/QC-1G eMMC4 (P/N 0

congatec 模块化计算机 - COM COM Express Compact module with Intel Atom x5-E3940 quad core processor with 1.6GHz core frequency up to 1.8GHz, 2MB L2 cache and up to 8GB 1866MT/s DDR3L SODIMM memory support. Industrial grade temperature range from -40 C to 85 C.
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congatec 模块化计算机 - COM COM Express Type 6 Basic module based on AMD embedded R-Series R1606G 2-core processor with 2.6 GHz up to 3.5 GHz turbo boost, 1MB L2 Cache and dual channel DDR4 2400MT/s memory interface (formerly Great Horned Owl). Features AMD Radeon Vega integr
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congatec 模块化计算机 - COM SMARC 2.0 module with advanced low-power 14nm NXP i.MX 8M Mini Quad processor. Features 4x ARM Cortex-A53 @1.8GHz and 1x ARM Cortex-M4, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. DisplayPort interface instead of LVDS. Commercial temperature ran
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congatec 模块化计算机 - COM COM Express Type 6 Compact module with Intel Core i7-7600U dual core processor with 2.8GHz up to 3.9GHz, 4MB Intel Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).
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congatec conga-QA3/E3845-4G eMMC16
congatec 模块化计算机 - COM Q7 INTEL ATOM E3845 BAY TRAIL COM TEMP
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congatec HPC/sILH-CSA-HP-T
congatec CPU与芯片冷却器 Standard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Threaded mounting with threaded standoffs M2.5.
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congatec 散热片 * Standard passive cooling for COM Express Mini Type10 module conga-MA5* For modules with IHS (lidded) CPU* All stand-offs are M2.5 threaded
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