STMicroelectronics 650V HB 系列沟槽式栅极场终止型 IGBT
STMicroelectronics 650V HB 系列沟槽式栅极场终止型 IGBT 是采用先进的、具有专利的沟槽式栅极和场终止型结构进行开发的 IGBT。这些器件在传导和开关损耗间取得最佳折中,使任何频率转换器的效率实现最大化。凭借 ST 先进的沟槽式栅极和场终止高速技术,这些 IGBT 具有最低程度的集电极电流断开拖尾,以及非常低的饱和电压(Vce(sat))(典型值低至 1.6V),尽可能降低了开关和打开过程中的电能损耗。此外,微正的 VCE(sat) 温度系数和非常紧密的参数分布实现了更为安全的并行工作。The HB2 series is an evolution of the advanced proprietary trench gate field-stop structure. The performance of the HB2 series is optimized in terms of conduction, thanks to a better VCE(sat) behavior at low current values, and in terms of reduced switching energy. A diode used for protection purposes only is co-packaged in antiparallel with the IGBT. The result is a product specifically designed to maximize efficiency for a wide range of fast applications.
特性
- Maximum junction temperature:
- TJ = 175°C
- High-speed switching series
- Minimized tail current
- Very low saturation voltage
- Tight parameters distribution
- Safe paralleling
- Low thermal resistance
- Very fast soft recovery anti-parallel diode
- Lead-free package
应用
- Photovoltaic inverters
- High frequency converters
发布日期: 2014-03-31
| 更新日期: 2026-01-12
