新款半导体

Microchip Technology dsPIC33AK256MPS306 General Purpose Dual In-Line Module (DIM) (EV02E57A) is designed to demonstrate the capabilities of the dsPIC33AK256MPS306 family. The board operation requires using the dsPIC33 Curiosity Platform Development Board (EV74H48A) with the Microchip Technology dsPIC33AK256MPS306 General Purpose DIM (EV02E57A). The user must order the EV74H48A separately and can use it for a wide variety of applications.
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Kingston LPDDR4x Low-Power DRAMsSupport data rates up to 4266 Mb/s and maintain backward compatibility with lower speeds.2026/7/10 -
Microchip Technology dsPIC33AK256MPS306 Motor Control DIM (EV22K90A)Used to evaluate the entire dsPIC33AK256MPS306 DSC family for motor control applications.2026/7/10 -
Microchip Technology dsPIC33AK256MPS306 General Purpose DIM (EV02E57A)Demonstrates the capabilities of the dsPIC33AK256MPS306 family of Digital Signal Controllers (DSCs).2026/7/10 -
Microchip Technology dsPIC33AK256MPS306 200MHz 32-Bit DSCThe device includes a 32-bit rich instruction set for optimized speed and program code size.2026/7/10 -
Diodes Incorporated AP7581EQ 150mA宽输入电压LDO稳压器该稳压器设计用于汽车电池供电应用。2026/7/9 -
Diodes Incorporated AP7582Q/EQ 300mA宽输入电压LDO稳压器这些稳压器设计用于汽车应用中的电池。2026/7/9 -
M5Stack PaperColor Development BoardFeatures a 4" E Ink Spectra 6 full-color e-paper display with 400x600 resolution.2026/7/9 -
STMicroelectronics EVLSTDRIVE631 演示板完整的三相逆变器,允许评估STDRIVE631P或STDRIVE631N特性。2026/7/9 -
Altera DK-A3W135BM16AEA Agilex™ 3 Development KitFor evaluating and prototyping high-performance Agilex™ 3 FPGA and SoC C-Series designs.2026/7/9 -
onsemi GaNEXUS™ GaN FETsWide-bandgap material properties for low gate & output charge, fast switching & enhanced efficiency.2026/7/8 -
M5Stack Cardputer Mesh KitCommunication terminal kit integrates LoRa Mesh networking with global positioning capabilities.2026/7/8 -
InnoComm SOG52 & SOG72 Starter KitsProvide a practical platform for OSM development, embedded prototyping, and early-stage evaluation.2026/7/7 -
InnoComm Genio 360P/360 EVK Evaluation KitsIntegrate an M.2 Wi‑Fi®/BLUETOOTH® module and provide a high‑performance IoT platform.2026/7/7 -
Microchip Technology PIC16F13254/55/74/75 28/40-Pin MicrocontrollersOffers a unique set of peripherals to implement hardware-based solutions.2026/7/7 -
Bourns CDDFN2表面贴装TVS二极管电子设备外部端口的ESD、EFT和浪涌保护,限制关键器件的损坏。2026/7/7 -
STMicroelectronics EVLMG7 MASTERGAN7电源模块子板基于氮化镓 (GaN) 的电源模块,配备MASTERGAN7,可快速创建新拓扑结构。2026/7/7 -
Renesas Electronics GaN 240W EPR解决方案一款高功率密度AC/DC解决方案,在宽Vin/Vout范围内支持高达500W的输出功率。2026/7/7 -
Renesas Electronics RRW221x GaN系统级封装 (SiP)集成SuperGaN GaN FET的零待机功率AC/DC数字SSR反激式控制器。2026/7/6 -
Texas Instruments TXB0606自动双向电平转换器6位非反相转换器,采用两个独立的可配置电源轨。2026/7/6 -
Texas Instruments TPS7E72低压差稳压器这些器件的静态电流仅为2.8µA,并支持 3V至30V的宽输入电压范围。2026/7/6 -
Texas Instruments TPS7E71低压差稳压器 (LDO)低静态电流设备,支持3V至30V的宽输入电压范围。2026/7/6 -
Texas Instruments ISO642x和ISO642x-Q1数字隔离器通用型双通道数字隔离器,支持基本隔离和增强隔离。2026/7/6 -
Cirque GlidePoint® Circle Trackpad Development KitsGets users up to speed with GlidePoint Circle Trackpads powered by Cirque Gen6 ASICs.2026/7/2 -
NXP Semiconductors MCXW236B-EXP附加板该扩展板可与广泛的MCU和MPU FRDM板卡实现连接。2026/7/2 -
Texas Instruments TRF0108SEP/SP 评估模块用于高达12GHz差分至单端信号转换的射频放大器EVM。2026/7/1 -
