新款射频/无线开发工具

Semtech LR2021评估套件包含2块LoRa Plus™射频板和Xiao nRF54L15模块,适用于全球2.4GHz频段。该系列套件基于LR2021打造,采用4层PCB设计,配备32MHz晶振参考时钟。LR2021评估套件的发射输出功率为22dBm至-10dBm(SubGHz)和12dBm(2.4GHz)。 该系列套件还包含两根带SMA连接器的2.4GHz天线,以及用于编程和供电的USB数据线。
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Silicon Labs SiWG917Y模块无线电板用于无线IoT开发的Wi-Fi 6和蓝牙LE无线电板。2026/7/23 -
Semtech LR2021EVK2XxS1 评估套件包含2块LoRa Plus™射频板和Xiao nRF54L15模块,适用于全球2.4GHz频段。2026/7/13 -
Quectel SR-IMXM-EVB Evaluation Board KitTool for developing applications and testing basic functionalities of SRG091X and SRG093X modules.2026/7/13 -
M5Stack Cardputer Mesh KitCommunication terminal kit integrates LoRa Mesh networking with global positioning capabilities.2026/7/8 -
Texas Instruments TRF0108SEP/SP 评估模块用于高达12GHz差分至单端信号转换的射频放大器EVM。2026/7/1 -
Nordic Semiconductor nRF54L15 Tag原型设计平台一款采用双天线设计的平台,可为蓝牙®信道探测提供更强的稳健性。2026/6/24 -
Quectel LS550G (00) GNSS ModulesSupports concurrent reception of GPS, GLONASS, Galileo, BDS, and QZSS constellations.2026/6/23 -
Mikroe SMA RAK11720 ClickDual wireless connectivity for long-range LoRaWAN and short-range BLE IoT designs.2026/6/19 -
Ezurio Veda™ IF913 Development KitDesigned for the evaluation of the Veda™ IF913 Wi-Fi® 6E + Bluetooth® LE 5.4 modules.2026/6/17 -
Quectel FGA66X Wi-Fi 6, BLE 5.4 & IEEE 802.15.4 ModulesHigh-performance module in an LGA package and supports the IEEE 802.11ax standard protocol.2026/6/17 -
Xsens Sirius RTK GNSS/INS Development KitsDesigned for centimeter-level positioning and orientation in the most challenging environments.2026/6/12 -
u-blox EVK-ANNA-B5 评估套件ANNA-B5独立蓝牙®低功耗模块评估套件。2026/6/12 -
Mikroe RF Switch 2 ClickCompact add-on board for high-frequency RF signal routing in wireless and signal-management designs.2026/6/1 -
Mikroe LTE Cat.1 5 Click for EuropeModule for 4G LTE cellular connectivity in European IoT, M2M, and consumer applications.2026/6/1 -
Mikroe LTE Cat.1 5 Click for North AmericaModule for 4G LTE cellular connectivity in North American IoT, M2M, and consumer applications.2026/6/1 -
M5Stack Stamp-AddOn C6 Wi-Fi Expansion ModuleBased on the ESP32-C6-MINI-1-N4, designed to extend the wireless communication capabilities.2026/5/5 -
CML Micro EV9942EF Evaluation BoardEnables detailed evaluation of the CMX994EF high‑performance direct conversion receiver IC.2026/4/17 -
Nordic Semiconductor nRF7002扩展板II插件板旨在为Nordic nRF54开发套件添加高级Wi-Fi® 6连接。2026/4/16 -
Mikroe EnOcean 5 ClickProvides a bidirectional communication interface for EnOcean-based sensors, switches, and actuators.2026/4/16 -
Mikroe WRLS 2.4GHz ClickCompact add-on board for BLUETOOTH® Low Energy wireless connectivity for short-range data exchange.2026/4/14 -
Digi XBee® Hive开发套件包含XBee蜂巢网关、XBee 3 DigiMesh、以太网、双频Wi-Fi®和蜂窝网络。2026/4/7 -
Ezurio Vela™ IF310 Development KitsProvide a platform for rapid development and testing of all variations of the Vela™ IF310 modules.2026/4/7 -
Digi ConnectCore 95开发套件该套件包含开发板、i.MX 95多核处理器、NPU、32GB eMMC和8GB LPDDR5无线片上系统(SoM)。2026/4/6 -
Espressif Systems ESP32-C3-DevKit-RUST-2 Development KitBased on the ESP32-C3-MINI-1 general-purpose module with 4MB SPI flash.2026/4/6 -
Quectel LG580P High-Precision GNSS ModulesSupport concurrent reception of GPS, GLONASS, Galileo, BDS, QZSS, and NavIC constellations.2026/3/31 -
