新款多协议模块

Murata Type 2NR低功耗蓝牙® 6.0模块是一款基于Nordic Semiconductor nRF54L15片上系统 (SoC) 打造的高集成度超小型无线模块。该模块将先进的无线连接性、集成安全性、Arm® Cortex®-M33处理器和灵活的外设接口集成到一个紧凑的封装 (7.4mm x 7mm x 1.4mm) 中。Type 2NR模块专为低功耗和高性能IoT应用而设计,支持低功耗蓝牙6.0、IEEE 802.15.4、Matter over Thread和NFC-A标签功能。支持的无线协议包括低功耗蓝牙、Zigbee®、Thread、Matter over Thread和专有2.4GHz通信。Murata Type 2NR低功耗蓝牙6.0模块非常适合需要强大射频性能、安全边缘处理和低功耗的应用。
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Murata 2NR低功耗蓝牙6.0模块基于Nordic Semiconductor nRF54L15 SoC打造的高集成度超小型无线模块。2026/8/11 -
Quectel FCM242D ModuleOffers a high-performance processor with a frequency up to 160MHz.2026/6/26 -
Quectel FCE870Q ModuleOffers 4K-QAM and 320MHz bandwidth, delivering a peak data rate of 5.8Gbps.2026/6/26 -
Quectel FGD966X Wi-Fi 6, BLE 5.4, & 802.15.4 ModuleHigh-performance module in an LGA package with an ultra-compact 12mm x 12mm x 2mm size.2026/6/17 -
Quectel FGA66X Wi-Fi 6, BLE 5.4 & IEEE 802.15.4 ModulesHigh-performance module in an LGA package and supports the IEEE 802.11ax standard protocol.2026/6/17 -
Quectel FCM363X Wi-Fi 6 & BLE 5.3 ModuleCutting-edge MCU Wi-Fi and BLUETOOTH® module.2026/6/15 -
Texas Instruments CC330xMOD SimpleLink™配套模块Wi-Fi 6和低功耗蓝牙模块使工程师能够可靠地连接应用程序。2026/3/12 -
Advantech AIW-173 Wi-Fi® 7/BLUETOOTH® 5.3模块支持IEEE 802.11be/ax/ac/b/g/n、BLUETOOTH® 5.3和Wi-Fi 7。2026/3/10 -
Silicon Labs MGM270S蓝牙®无线模块基于系列2 EFR32MG27 SoC的安全、高性能Zigbee® + 蓝牙低功耗模块。2026/2/3 -
Telit Cinterion ME310M1 LTE Cat M1/NB2 LGA ModulesDesigned for massive IoT deployments that demand long battery life and secure connectivity.2026/1/9 -
DFRobot LattePanda IOTA x86 Single Board ComputersPalm‑sized x86 SBCs built around the powerful N150 quad‑core processor, clocking up to 3.6GHz.2025/12/23 -
Espressif Systems ESP32-C61-MINI-1 Wi-Fi & BLE ModuleA powerful, general-purpose, high-performance module with a rich set of peripherals.2025/11/25 -
Murata Type 2FP多无线电模块基于NXP RW610无线MCU的紧凑型高集成度多无线电模块。2025/11/3 -
Advantech AIW-169BR Wi-Fi® 6e嵌入式无线模块IEEE 802.11 ax/ac/b/g/n+蓝牙® 5.3 HS解决方案,能够支持6GHz频段。2025/10/3 -
Advantech AIW-357 5G WWAN模块该模块配备T700 5G调制解调器,提供高速率和超低延迟。2025/9/30 -
M5Stack Stamp-S3A Multiprotocol ModulesHighly integrated embedded modules based on the Espressif ESP32-S3FN8.2025/9/1 -
Ezurio Veda IF912/IF913 Wi-Fi 6/6E + BLUETOOTH LE ModulesA scalable path from dual-band Wi-Fi 6 to tri-band Wi-Fi 6E, using a common connected MCU platform.2025/8/31 -
Murata 2LL型Wi-Fi®6/蓝牙®/802.15.4模块基于NXP IW610G组合芯片组的小型高性能模块。2025/7/23 -
Murata 超紧凑Type 2KL Wi-Fi®与BLUETOOTH®模块为现代IoT项目中的许多应用提供强大的无线连接解决方案。2025/7/23 -
Würth Elektronik Skoll-I BLUETOOTH®无线电模块将经典蓝牙和低功耗蓝牙5.4版本结合在一个紧凑的解决方案中。2025/7/11 -
Espressif Systems ESP32-C61-WROOM-1-N8R2 ModuleA general-purpose 2.4GHz Wi-Fi® 6 (802.11ax), BLUETOOTH® 5 (LE) module.2025/7/9 -
Murata 2FY型无线连接模块采用英飞凌CYW55513芯片组,支持2.4GHz、5GHz和6GHz频段。2025/6/24 -
STMicroelectronics ST67W Wi-Fi® 6/蓝牙5.4/Thread模块可简化工业和消费电子IoT应用的下一代无线解决方案的开发。2025/6/3 -
u-blox MAYA-W4三射频模块支持双频Wi-Fi®6、低能耗蓝牙®5.4和802.15.4的无线连接模块2025/5/13 -
NXP Semiconductors IW610 IoT优化型Wi-Fi® 6三频模块将Wi-Fi 6、低功耗蓝牙® 5.4和802.15.4无线电集成到紧凑型解决方案中。2025/5/6 -
